Technical Details

• Part Status Active
• Architecture DSP, MPU
• Core Processor ARM® Cortex®-M4, C66x
• Flash Size -
• RAM Size 512kB
• Peripherals DMA, PWM, WDT
• Connectivity CAN, MMC/SD/SDIO, McASP, I2C, SPI, UART, USB
• Speed 212.8MHz, 745MHz
• Primary Attributes -
• Operating Temperature -40°C ~ 125°C (TJ)
• Package / Case 367-BFBGA, FCBGA
• Supplier Device Package 367-FCBGA (15x15)
• Number of I/O 126
• RoHS Status Not applicable
• Moisture Sensitivity Level (MSL) 3 (168 Hours)
• ECCN 3A991A1
• HTSUS 8542.31.0070