Technical Details

• Part Status Active
• Architecture DSP, MPU
• Core Processor ARM® Cortex®-A15, Dual ARM® Cortex®-M4, C66x
• Flash Size -
• RAM Size 2.5MB
• Peripherals DMA, POR, PWM, WDT
• Connectivity CANbus, Ethernet, MMC/SD/SDIO, McASP, I2C, SPI, UART, USB
• Speed 500MHz
• Primary Attributes -
• Operating Temperature -40°C ~ 125°C (TJ)
• Package / Case 760-BFBGA, FCBGA
• Supplier Device Package 760-FCBGA (23x23)
• Number of I/O 247